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Wire bond loop profile development for fine pitch-long wire assembly

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3 Author(s)
Shu, B. ; VLSI Technol. Inc., San Jose, CA, USA ; Lee, S.S. ; Groover, R.

It is confirmed that the response surface methodology makes it possible to define the bonding parameters required to produce the `ideal' loop profile for greater than 150 mil wire length. If one chooses to change the loop profile, the data already exist from the chart generated. The changes in the bonding parameters and the changes in the loop profile from 150 mil to 175 mil wire lengths are well characterized. In almost all cases the differences are well understood. These data could imply that the manufacturability of 175 mil wire lengths versus 150 mil may be more forgiving, because the `ideal' 175 mil wire loop has a larger window of operation than that of a 150 mil wire

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1991. ASMC 91 Proceedings. IEEE/SEMI 1991

Date of Conference:

21-23 Oct 1991