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Technology transfer: a three-prong approach

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2 Author(s)
Brown, K.H. ; IBM, Hopewell Junction, NY, USA ; Grose, D.A.

Defines a three-prong approach to address the fundamental problems traditionally encountered in semiconductor technology transfer. The three `prongs' are manufacturability built-in; careful evaluation and specification of new tools and processes; and integrated manufacturing and engineering teams for technology development and ownership

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1991. ASMC 91 Proceedings. IEEE/SEMI 1991

Date of Conference:

21-23 Oct 1991