Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. We apologize for any inconvenience.
By Topic

On sampling algorithms in multilevel QR factorization method for magnetoquasistatic analysis of integrated circuits over multilayered lossy substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Hao Gang Wang ; Wireless Commun. Res. Center, City Univ. of Hong Kong ; Chi Hou Chan ; Leung Tsang ; Jandhyala, V.

This paper proposes improvements in the row and column samplings of the multilevel QR factorization method known as IES3, a fast integral equation solver previously proposed for efficient three-dimensional (3-D) parameter extraction. First, a rigorous Gram-Schmidt row sampling is developed to replace the row sampling algorithm in IES3, leading to a more stable algorithm. Second, to further enhance the efficiency of column sampling, a new scheme based on the idea of locating the interpolation points is presented. Error analyses indicate that the proposed schemes have higher accuracies than the original sampling in IES3, especially when the number of sampled points is small. The IES3 that uses one of these improved algorithms is called improved multilevel matrix QR factorization (IMLMQRF). These IMLMQRFs are applied in the magnetoquasistatic analysis of printed circuits on multilayered lossy medium for extractions of inductances and resistances. The frequency dependency of such parameters is also illustrated

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:25 ,  Issue: 9 )