Cart (Loading....) | Create Account
Close category search window
 

Fluidic heterogeneous microsystems assembly and packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wei Zheng ; Dept. of Electr. & Comput. Eng., Minnesota Univ. ; Chung, Jaehoon ; Jacobs, H.O.

The nonrobotic fabrication of packaged microsystems that contain nonidentical parts has been accomplished by a directed self-assembly process. The self-assembly process uses geometrical shape recognition to identify different components and subsequent bond formation between liquid solder and metal-coated areas to form mechanical and electrical connections. We applied this concept of shape recognition and subsequent formation of contacts to assemble and package microsystems that contained nonidentical subunits. The self-assembly of three-component assemblies is demonstrated by sequentially adding device segments to the assembly solution including 200-mum-sized light-emitting diodes. Six hundred AlGaInP-GaAs light-emitting diode segments self-assembled onto device carriers in 2min without defects. Encapsulation units self-assembled onto the LED-carrier assemblies to form a three-dimensional (3-D) circuit path to operate the final device. The reported procedure provides a new route to the creation of autonomous heterogeneous microsystems including the realization of autonomous wireless sensor system that requires nonidentical units: CMOS circuitry, Non-CMOS sensor unit for sensing, III-V components for communication, and encapsulation units to form 3-D electrical interconnects. The creation of such systems is being discussed and a proof of concept experiment is being demonstrated

Published in:

Microelectromechanical Systems, Journal of  (Volume:15 ,  Issue: 4 )

Date of Publication:

Aug. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.