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A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging

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2 Author(s)
B. H. Stark ; Michigan Univ., Ann Arbor, MI, USA ; K. Najafi

This paper demonstrates a technique to premold and transfer lead-free solder balls for microelectrocmechanical systems (MEMS)/electronics packaging applications. A reusable bulk micromachined silicon wafer is used to mold a solder paste and remove excess flux prior to transfer to a host wafer that may contain released MEMS. This technique has been used to fabricate low temperature thin film MEMS vacuum packages. Long term (>5 months) reliability of these packages at room temperature and pressure is demonstrated through integrated Pirani gauges. These packages have survived over 600 hours in an autoclave (130degC, 85% RH, 2 atm) and more than 1300 temperature cycles (55degC to 125degC)

Published in:

Journal of Microelectromechanical Systems  (Volume:15 ,  Issue: 4 )