Cart (Loading....) | Create Account
Close category search window
 

Application of neural networks in optical inspection and classification of solder joints in surface mount technology

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Acciani, G. ; Dipt. di Elettrotecnica ed Elettronica, Bari Univ. ; Brunetti, G. ; Fornarelli, G.

The defect detection on manufactures is extremely important in the optimization of industrial processes; particularly, the visual inspection plays a fundamental role. The visual inspection is often carried out by a human expert. However, new technology features have made this inspection unreliable. For this reason, many researchers have been engaged to develop automatic analysis processes of manufactures and automatic optical inspections in the industrial production of printed circuit boards. Among the defects that could arise in this industrial process, those of the solder joints are very important, because they can lead to an incorrect functioning of the board; moreover, the amount of the solder paste can give some information on the quality of the industrial process. In this paper, a neural network-based automatic optical inspection system for the diagnosis of solder joint defects on printed circuit boards assembled in surface mounting technology is presented. The diagnosis is handled as a pattern recognition problem with a neural network approach. Five types of solder joints have been classified in respect to the amount of solder paste in order to perform the diagnosis with a high recognition rate and a detailed classification able to give information on the quality of the manufacturing process. The images of the boards under test are acquired and then preprocessed to extract the region of interest for the diagnosis. Three types of feature vectors are evaluated from each region of interest, which are the images of the solder joints under test, by exploiting the properties of the wavelet transform and the geometrical characteristics of the preprocessed images. The performances of three different classifiers which are a multilayer perceptron, a linear vector quantization, and a K-nearest neighbor classifier are compared. The n-fold cross-validation has been exploited to select the best architecture for the neural classifiers, while a number of experiments have bee- - n devoted to estimating the best value of K in the K-NN. The results have proved that the MLP network fed with the GW-features has the best recognition rate. This approach allows to carry out the diagnosis burden on image processing, feature extraction, and classification algorithms, reducing the cost and the complexity of the acquisition system. In fact, the experimental results suggest that the reason for the high recognition rate in the solder joint classification is due to the proper preprocessing steps followed as well as to the information contents of the features

Published in:

Industrial Informatics, IEEE Transactions on  (Volume:2 ,  Issue: 3 )

Date of Publication:

Aug. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.