Cart (Loading....) | Create Account
Close category search window
 

Electrical characterization of flip-chip interconnects formed using a novel conductive-adhesive-based process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Lohokare, S.K. ; Dept. of Electr. & Comput. Eng., Univ. of Delaware, Newark, DE ; Lu, Z. ; Schuetz, C.A. ; Prather, D.W.

Using conventional microfabrication techniques, we have developed a new, low-cost wafer bumping process that enables a high degree of control over patterning of conductive adhesive interconnects. This approach obviates the need for development of dispensing and scraping head equipment that may otherwise be required for mass fabrication of lithographically patterned adhesive bumps. Flip-chip interconnects formed using this new process offer better electrical performance as compared to those formed by squeegee-based definition techniques. This is inferred in this paper by experimentally demonstrating lower contact resistance with the polished bumps as compared to the squeegeed bumps. Furthermore, in order to study the high-speed electrical performance characteristics of these conductive adhesive bumps, a 10-GHz 1.55-mum p-i-n photodetector fabricated in the antimonide material system was used as case study. The results from the bandwidth characterization of the polymer flip-chip-integrated detector showed minimum degradation in the high-speed performance characteristics of the detector

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:29 ,  Issue: 3 )

Date of Publication:

Aug. 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.