By Topic

Adhesive joint design for minimizing fiber alignment shift during UV curing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Yaomin Lin ; OptoElectron. Integration & Packaging Lab., Univ. of California, Irvine, CA ; Wenning Liu ; Shi, F.G.

In fiber-optic device packaging using UV curable adhesive bonding, the curing process often causes fiber alignment shift-distortion of the already aligned fiber-optic setups, and thus reduce the assembly yield. A new method for the adhesive joint design for minimizing fiber alignment shift during adhesive curing is reported in this paper. It is demonstrated that for any adhesive, the bonding joint can be designed to alleviate the alignment shift, regardless of adhesives used. The approach provides guideline for high yield and low-cost assembly of fiber-optic devices using adhesive bonding

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:29 ,  Issue: 3 )