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Novel microcontacts in microwave chip carriers developed by UV-liga process part II

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6 Author(s)

This paper presents the design and development of novel type microcontacts in monolithic microwave integrated circuit (MMIC) chip-carriers to printed circuit board (PCB) assembly. Several new concepts of microcontacts for packaging solutions of microwave and millimeter-wave MMIC are depicted. Simulation and vector network analyzer (VNA) measurement results for these microcontact transitions are discussed. The results show that the electrical parameters are highly dependent on the transition dimensions and substrate features. These contacts are based on male stud (bump) and female (ring) concept. When mating each other, there are clips effect and self-alignment features. Special attention is paid to the shape of the microcontacts in order to facilitate assembly and strengthen the connection. Equivalent electrical circuit is proposed for PSPICE simulation of the dc contact resistance. Finally, the article discusses the technological implementation of the proposed new microcontact stud-ring through low-cost ultraviolet electroplating, lithography, and molding (UV-LIGA) process and the regime influence on the shape, geometry, and mating capabilities. Results from mechanical pull and adhesion tests are also discussed

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Advanced Packaging, IEEE Transactions on  (Volume:29 ,  Issue: 3 )