Cart (Loading....) | Create Account
Close category search window
 

Controlled Growth of Well-Aligned Carbon Nanotubes and Their Assembly

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Lingbo Zhu ; Sch. of Chem. & Biomolecular Eng., Georgia Inst. of Technol., Atlanta, GA ; Jianwen Xu ; Yonghao Xiu ; Hess, D.W.
more authors

Carbon nanotubes (CNTs) have been proposed for applications in microelectronic applications, especially for electrical interconnects and nanodevices, due to their excellent electrical, thermal and mechanical properties. In order to create interconnect structures comprised of CNT units, it is necessary to control the growth of CNTs in predefined orientations and configurations at a temperature compatible with current microelectronics fabrication process, and the interface with other materials such as metal electrodes. In this paper, we reported a very efficient method to grow well-aligned CNT films/arrays. For aligned CNT array growth, a lift-off process was used to pattern catalyst (Al2O3/Fe) islands to diameters of 13 or 20 mum After patterning, chemical vapor deposition (CVD) was invoked to deposit highly aligned CNT arrays using ethylene as the carbon source, and argon and hydrogen as carrier gases. The as-grown CNTs were characterized by high resolution transmission electron microscopy (HRTEM), scanning electron microscopy (SEM). To circumvent the high carbon nanotube (CNT) growth temperature and poor adhesion with the substrates that currently plague CNT implementation, we proposed using novel CNT transfer technology, enabled by open-ended CNTs. The process is featured with separation of CNT growth and CNT device assembly. This novel technique shows promising applications for positioning of CNTs on temperature-sensitive substrates, and for the fabrication of field emitters, electrical interconnects, thermal management structures in microelectronics packaging

Published in:

Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

Date of Conference:

0-0 0

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.