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Novel All Organic High Dielectric Constant Polyaniline/epoxy Composites for Embedded Capacitor Applications

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4 Author(s)
Jiongxin Lu ; School of Materials Science and Engineering, and Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332-0245, USA ; Kyoung-Sik Moon ; Byung-Kook Kim ; C. P. Wong

In-situ polymerization of aniline salt within epoxy matrices with various content of polyaniline (PANI) was successfully carried out to prepare PANI/epoxy composites. A flexible PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss less than 0.5 at room temperature and 10 kHz. The influence of PANI loading levels on various properties was also explored. Scanning electron microscopy (SEM) was used to characterize the morphology of PANI/epoxy composites

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2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface

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