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A Practical Electrolyte for the Electrodeposition of Eutectic Gold/Tin Alloy

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1 Author(s)
Hradil, G. ; Technic Inc., Cranston, RI

Gold-tin alloys are useful in many microelectronic applications, including chip bonding and wafer bump plating. The 80-20 wt% (70-30 at%) gold-tin eutectic alloy is particularly desirable as a solder. Electro-deposition is a low cost alternative to currently employed techniques such as sputtering, plasma jet or the use of solid alloy preforms

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Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

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