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Materials and Processing Impacts on Flip Chip Assembly using Pre-applied Underfill

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1 Author(s)
Esler, D. ; GE Global Res., Niskayuna, NY

Summary form only given. Pre-applied underfill materials for eutectic tin lead flip chip solder attach have been developed to produce void free, reliable assemblies. Lead free flip solder attach presents a number of challenges for quality assembly using pre-applied underfill. Factors that effect fluxing, yield, and voiding will be addressed

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Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

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