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Adhesive Bonding Process Development for Planar Lightwave Circuit in Optical Transceiver Assembly

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3 Author(s)
Cai Liang ; Samuel Ginn Coll. of Eng., Auburn Univ., AL ; Xiaofeng Zhou ; Fajian Zhang

Glass based planar lightwave circuit (PLC) is one of the core components employed in optical transceiver operation. Assembly of PLC onto a silicon optical bench (SiOB) is a crucial step, since it requires actively aligning the PLC to both a laser diode and an optical fiber. We have successfully developed an adhesive bonding process for buried type planar glass wave-guide circuit assembly in optical transceiver packaging with the powerful design optimal experiment tool. A dosage of 280j/cm2 with intensity of 15000mw/cm2 UV curing followed by 15 minutes 110degC thermal cure process is able to achieve 0.2dB optical coupling power loss for PLC-fiber assembly

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Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

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