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A creep-rupture model for two-phase eutectic solders

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3 Author(s)
B. Wong ; Hughes Aircraft Co., El Segundo, CA, USA ; D. E. Helling ; R. W. Clark

An analytical framework to predict failure of solders under creep conditions is proposed. A creep-rupture model for two-phase eutectic solders, based on both micromechanics and fracture mechanics, has been developed. The general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creep-rupture process.<>

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:11 ,  Issue: 3 )