By Topic

Electrical characteristics of single buried microstrip lines in the TEM approximation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
J. L. Prince ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; R. Santhinathan ; O. A. Palusinski ; M. R. Scheinfein

Several design parameters for the analysis of the performance of buried microstrip-like interconnect geometries under the assumption of TEM-mode wave propagation are examined. Electrical characteristics of buried microstrip are investigated over a wide range of practical values of material parameters and geometries. The result is a set of curves which can be used for substrate design for a wide range of dielectric constants and for a variety of practical geometries.<>

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:11 ,  Issue: 3 )