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Engineering software-multichip routing and placement

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1 Author(s)
Wayne Wei-Ming Dai ; Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA

The demands being placed on CAD systems by current advances in packaging technology, in particular, the need to design interconnecting networks for thin-film multichip modules (MCMs), are discussed. The approaches embodied in several recently developed software packages are described. These include interactive placement and routing, warping, shape-based routing, rubber-band routing, and correct by design. The role of concurrent engineering in the design process is examined

Published in:

Spectrum, IEEE  (Volume:29 ,  Issue: 11 )