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Advances in wire bonding technology for high lead count, high-density devices

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3 Author(s)
Shah, G.N. ; Kulicke & Soffa Ind. Inc., Willow Grove, PA, USA ; Levine, L.R. ; Patel, D.I.

How present challenges are being met by the innovation taking place in wire-bonding technology is discussed. A wire-bonder system accuracy model is discussed. Factors that affect minimum pad-size requirement and fine pitch capability are described. The requirements for attaining true-bond program portability are analyzed. Results of designed experiments undertaken to better understand the wire-bonding process are also presented.<>

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:11 ,  Issue: 3 )