This contribution presents a novel simulation tool for the electrothermal analysis of solid-state devices and circuits in both static and transient conditions. The code relies on an effective analytical approach to describe the 3D thermal process, and exploits the engine of the commercial software ADS (Advanced Design System) to consistently solve the electrical and thermal networks. Features like model accuracy, lack of convergence problems, low time/memory requirements, flexibility and user friendliness make the proposed software a good alternative to SPICE-like and fully numerical tools for the optimization of both reliability and performance of state-of-the-art devices/circuits
Published in:
Microelectronics, 2006 25th International Conference on
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