Referenced Items are not available for this document.
Methods for predicting and analyzing the behavior of NTC thermistors have remained the same and they typically include accurate measurements of resistance and temperature, followed by curve-fitting methodologies for determining the relationship of temperature to resistance for similar thermistor devices. In this paper, new approach based on using commercial software tools was applied on the thick film segmented thermistor models. Obtained simulation results were compared with experimental results and validity of the adopted approach verified. Realized segmented thermistors were made of a low temperature NTC thick film paste NTC 3K3 95/2 with nanometer particle powder printed on alumina
Published in:
Microelectronics, 2006 25th International Conference on
Date of Conference: 0-0 0
- Page(s):
- 447 - 450
- Print ISBN:
- 1-4244-0117-8
- INSPEC Accession Number:
- 9085760
- Conference Location :
- Belgrade
- Digital Object Identifier :
- 10.1109/ICMEL.2006.1650997
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