By Topic

Multi-objective module placement for 3-D system-on-package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Eric Wong ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Minz, J. ; Sung Kyu Lim

System-on-package (SOP) is a viable alternative to system-on-chip (SOC) for meeting the rigorous requirements of today's mixed-signal system integration. Thermal integrity is arguably the most crucial issue in three-dimensional (3-D) SOP due to the compact nature of the 3-D integration. In addition, the power supply noise issue becomes more serious as the supply voltage continues to decrease while the number of active devices consuming power increases. We propose a 3-D module and decap (decoupling capacitance) placement algorithm that evenly distributes the thermal profile and reduces the power supply noise. In addition, we allocate white spaces around the modules that require decaps to suppress the power supply noise while minimizing the area overhead. In our experimentation, we achieve improvements in both maximum temperature and decap amount with only small increase in area, wirelength, and runtime.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:14 ,  Issue: 5 )