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Die attach quality testing by fully contact-less measurement method

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4 Author(s)
G. Bognar ; Dept. of Electron Devices, Budapest Univ. of Technol. & Econ. ; G. Horvath ; Z. Szucs ; V. Szekely

The paper presents a novel, fully contact-less method for detecting die attach problems of semiconductor devices by measuring the dilatation resulting from thermal expansion. Laser interferometer measuring system was used to measure the thermal dilatation caused by infrared radiation directed onto the measured structure. By using the contact based stylus measurement method the previously got results have been cross-verified

Published in:

2006 IEEE Design and Diagnostics of Electronic Circuits and systems

Date of Conference:

18-21 April 2006