Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology

The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental for wire bonding and wire-pull tests. Excellent agreements are obtained as compared with the experimental data