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Evaluation and Numerical Simulation of Optimal Structural Designs for Reliable Packaging of Ultra Low K Process Technology

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11 Author(s)
Huang, T.C. ; Adv. Module Technol. Div., Taiwan Semicond. Manuf. Co., Ltd., Hsin-Chu ; Peng, C.T. ; Yao, C.H. ; Huang, C.H.
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The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental for wire bonding and wire-pull tests. Excellent agreements are obtained as compared with the experimental data

Published in:

Interconnect Technology Conference, 2006 International

Date of Conference:

5-7 June 2006