Referenced Items are not available for this document.
The die edge-seals and circuit under fad (CUF) are structurally optimized through 3D finite element analysis (FEA). Die edge-seals having the mechanically reinforced structure units are demonstrated essential. It is also shown that FEA help extract useful structural design concepts for CUP. The Poisson effects leading to a dual-ring-shaped high stress distribution area are confirmed to be detrimental for wire bonding and wire-pull tests. Excellent agreements are obtained as compared with the experimental data
Published in:
Interconnect Technology Conference, 2006 International
Date of Conference: 5-7 June 2006
- Page(s):
- 92 - 94
- Print ISBN:
- 1-4244-0104-6
- INSPEC Accession Number:
- 9088832
- Conference Location :
- Burlingame, CA
- Digital Object Identifier :
- 10.1109/IITC.2006.1648655
- Product Type:
- Conference Publications
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