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Special Feature New Chip Carrier Package Concepts

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2 Author(s)
J. W. Balde ; Western Electric ; D. I. Amey

The chip carrier concept was originally conceived as a square ceramic semiconductor package that could be surface reflow soldered to a ceramic substrate. Its advantages of reduced package size, higher board packing density, lower lead inductance and internal propagation delay, and easy assembly and disassembly were, unfortunately, limited to largely military applications.

Published in:

Computer  (Volume:10 ,  Issue: 12 )