Application and RF performance of integrated resistor structures on non-planar topologies in micro-machined silicon packages for transmitter optical subassemblies

A hermetic active optical component package is presented which incorporates a resistive metallization layer on the component submount, which allows structuring resistors of a large range of resistances. The use of such integrated resistors for impedance matching applications and in broadband RF chokes are discussed. Designs, simulations and measurements are presented, which demonstrate the reduction in footprint possible by integrating the matching resistor on sloped side-walls, and how an appropriately designed RF choke inside the package can enable advanced testing procedures such as wafer-scale laser diode burn-in with simultaneous RF performance characterization.