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High resolution time domain and frequency domain package characterization up to 65 GHz

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4 Author(s)
Engl, M. ; Infineon Technol. AG, Neubiberg ; Schiller, K. ; Eurskens, W. ; Weigel, R.

We present a measurement setup for high resolution time domain and frequency domain package characterization. The measurement setup features a sub-mm spatial resolution, which enables accurate time domain measurements of actual small sized package types. We evaluate common calibration techniques and their suitability for package characterization in order to get most accurate measurement results. Further, we demonstrate the versatile utilization of time domain measurement techniques. Accurate impedance characterization and fault analysis of packages is achieved. In addition, we show frequency domain characterization of packages up to 65 GHz

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Electronic Components and Technology Conference, 2006. Proceedings. 56th

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