Referenced Items are not available for this document.
This paper presents our effort to predict IC, packaging, and board level reliability problems. Micro-electronic based reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro-swelling, and/or the degradation of interfacial strength. In the past, such reliability problems were treated separately, but recent development have made clear that total product reliability concerns the interaction of IC, package, and PCB. This paper presents parts of our strategy to assess this integrated reliability by combining experimental and numerical techniques
Published in:
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Date of Conference: 0-0 0
- ISSN :
- 0569-5503
- Print ISBN:
- 1-4244-0152-6
- INSPEC Accession Number:
- 9075412
- Conference Location :
- San Diego, CA
- Digital Object Identifier :
- 10.1109/ECTC.2006.1645774
- Product Type:
- Conference Publications
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