By Topic

Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xuejun Fan ; Intel Corp., Chandler, AZ ; Min Pei ; Bhatti, P.K.

Solder joint fatigue life in thermal cycling has been studied for decades using the finite element method. A great variety of modeling methodologies such as global/local modeling (sub-modeling) and sub-structure modeling (superelement) has been developed. Many different types of constitutive equations for solder alloys, various loading assumptions, and several definitions of damage parameters have been used. However, the accuracy of these different modeling approaches has not been completely evaluated in literature. There has been some long-standing confusion regarding the modeling assumptions and their effect on the accuracy of models, such as the initial stress-free temperature setting, selection of damage parameters, and choice of element type. This paper presents a comprehensive study of finite element modeling techniques for solder joint fatigue life prediction. Several guidelines are recommended to obtain consistent and accurate finite element results

Published in:

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Date of Conference:

0-0 0