Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. For technical support, please contact us at We apologize for any inconvenience.
By Topic

Reliability analysis of SnPb and SnAgCu solder joints in FC-BGA packages with thermal enabling preload

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Bhatti, P.K. ; Intel Corp., Chandler, AZ ; Min Pei ; Xuejun Fan

Modern semiconductor devices in many applications require a thermal solution to remove the heat away from the device and maintain a certain operating temperature. These thermal solutions typically use a heat sink and a thermal interface material (e.g. thermal grease) between the device and the heat sink. A compressive load is applied to reduce the thermal resistance of the interface and facilitate better heat transfer from the device to heat sink. Depending on the magnitude, this compressive preload may affect the fatigue behavior of second level solder joints connecting the device to PCB in a thermal cycling environment. This paper describes the experimental setup and test results to evaluate the reliability of solder joints in the presence of a preload. 3-D nonlinear finite element analysis is performed to simulate the effect of compressive load in thermal cycling. Both SnPb and SnAgCu solder alloys are studied with various levels of preload

Published in:

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Date of Conference:

0-0 0