By Topic

Ultra high conductivity of isotropic conductive adhesives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Hongjin Jiang ; Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Kyoung-sik Moon ; Yi Li ; C. P. Wong

Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Morphology studies showed that the decreased resistivity resulted from the sintering of silver nanoparticles. The contact resistance of the conductive adhesives under 85degC/85%RH was significantly stable with respect to aging time due to the further sintering of silver nanoparticles

Published in:

56th Electronic Components and Technology Conference 2006

Date of Conference:

0-0 0