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A large number of I/O connections using compliant bump

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2 Author(s)
N. Watanabe ; Center for Microelectron. Syst., Kyushu Inst. of Technol., Fukuoka, Japan ; T. Asano

We demonstrate a large number of I/O connections (number of bumps: 10,000, size/pitch: 10 mum/20 mum) using the compliant bump. The bump connection test was carried out by using not only daisy chain but also active-matrix switch array. These tests revealed that the compliant bump suppresses the bonding failure. We also demonstrate that the compliant bump is very effective in reducing the change in characteristic of MOSFET even when bump bonding is performed directly on the MOSFET

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56th Electronic Components and Technology Conference 2006

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