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2006 Proceedings. 56th Electronic Components & Technology Conference (IEEE Cat. No. 06CH37766C)

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The following topics are dealt with: flip chip; drop/impact reliability; innovated interconnects and processes; nanotechnology; electrical systems; lead free solders; advanced substrates; advanced packages reliability; wafer level and 3D interconnects; shock, vibration and transient bending; flip chip underfills and encapsulants; integrated RF components; wafer level packaging; test and qualification methods; bump electromigration and reliability; biotechnology; modeling of Cu-low K, 3D packaging, lead-free solders; optical interconnects; lead free interconnects reliability; advanced adhesives; advanced assembly processing for chip stacking packages; low cost/light source manufacturing; MEMS; lead free characterization; next generation first level interconnects; electrical modeling and characterization; materials and manufacturing of 3D packages; RF modules and systems; SiP/SoP; encapsulated microelectronics reliability; board-level interconnects; passives and substrates; high speed/transceivers; and low-K assembly packaging processes

Published in:

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Date of Conference:

May 30 2006-June 2 2006