Cart (Loading....) | Create Account
Close category search window

Thermal imaging for detecting thermal interface issues in assembly and reliability stressing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Gupta, A. ; Design Process Dev., Intel Corp., Chandler, AZ ; Yongmei Liu ; Zamora, N. ; Paddock, T.

This paper describes the development of a non-destructive thermal imaging technique to detect thermal interface material defects in integrated heat spreader in advanced microprocessors. This technique allows capturing the surface infrared emission response as a function of time using high speed infrared camera. The infrared response of the surface of the integrated heat spreader is captured immediately after powering up the silicon die internally or applying pulsed external heating to the surface. With the presence of thermal interface material defects, the heat flow is disrupted and is reflected on the surface thermal distribution of integrated heat spreader. Since the thermal response of the heat spreader is affected by the thermal interface material defects underneath, the technique can be used to evaluate thermal interface material defects and thermal degradation. We show the successful application of this technique to capture various types of artificially created defects such as voiding. We also show that post thermally cycling and stressing, the thermal signature degrades for all units tested. This paper discusses the results obtained using the internal die heating only as it provided better results for all cases, as compared to pulsed external heating

Published in:

Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on

Date of Conference:

May 30 2006-June 2 2006

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.