By Topic

Thermal Performance Comparison between Various RF Transceiver Modules

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
V. A. Chiriac ; Adv. Packaging & Syst. Integration, Freescale Semicond. Inc., Temne, AZ ; Tien-Yu Tom Lee

A detailed numerical study was conducted to investigate the thermal behavior of three RF transceiver modules in a custom environment. The system incorporates the transceiver device and the high density interconnects (HDI) substrate at a fixed boundary condition. In general, the transceiver module requires lesser heat dissipation and thermal requirement may not be as critical as for the power amplifier (PA) module. However, its low thermally conductive die attach material, reduced size of the active areas (micron range) and fairly high power densities lead to the concern that the thermal budget (150 degC) may be exceeded under the various operating scenarios. Each transceiver module was modeled in detail including the device local discrete heat sources, the substrate metal layers, and micro and buried vias distribution across the dielectric layers. The impact of via locations in the substrate is also examined to address the die reliability issues. Results indicated that due to the low power dissipation, the predicted peak temperatures of all three Transceiver modules are below the 150 degC thermal budget. Analyses also suggest that the vias located directly under the die could be removed without any significant thermal penalty. Also, by strategically placing a few vias near the heat sources while removing rest of them in the substrate; it will still satisfy the overall thermal requirements. A detailed comparison between various transceiver designs and associated thermal performance is provided

Published in:

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

Date of Conference:

May 30 2006-June 2 2006