By Topic

Planar antennas in LTCC technology with transceiver integration capability for ultra-wideband applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Brzezina, G. ; Dept. of Electron., Carleton Univ., Ottawa, Ont. ; Roy, L. ; MacEachern, L.

We present two novel ultra-wideband (UWB) antennas embedded in a low-temperature co-fired ceramic (LTCC) package designed to house the UWB transceiver chip. Given their planar topology, circuit integration possibilities, and compact size, a partial ground-plane triangular monopole antenna (PGP-TM) and an antipodal Vivaldi antenna (AVA) are fully characterized. The performance in both the frequency and time domain are presented. The PGP-TM employs parasitic elements for tuning of the antenna's return loss. The PGP-TM antenna's measured 3.5-6.5-GHz bandwidth and omnidirectional pattern with 0-dB gain is suitable for the direct-sequence UWB (DS-UWB) lower subband, while the AVA's measured bandwidth of 3.35 GHz from 6.65 to 10 GHz and 5-dB gain make it suitable for the DS-UWB upper subband. The complete LTCC module containing the PGP-TM measures only 30 mmtimes25 mmtimes1.2 mm, while the AVA module measures 50 mmtimes25 mmtimes1.2 mm. Both LTCC modules can accommodate transceiver electronics because of a specially designed circuit feature. The effects of path loss can be canceled by combining these antennas in a transmission system. These are believed to be the first demonstrations of system-in-package technology for UWB applications

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:54 ,  Issue: 6 )