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A Numerical Study on Temperature Increase in the Resistive SFCL Element Due to the Quench Condition

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3 Author(s)
Kim, C.H. ; Dept. of Automotive Eng., Seoul Nat. Univ. of Technol. ; Lee, K.M. ; Ryu, K.W.

A transient numerical simulation was conducted to have variation of temperature on an element of resistive SFCL (Superconducting Fault Current Limiter) under quench condition. It is very important engineering information for an optimum design of cryogenic system for cooling of a resistive SFCL element. A bifilar coil for resistive SFCL for 10 MVA system was incorporated as a model in this numerical study. From the result, it was found that the averaged temperature on the shunt and Bi-2212 element at 500 kW, 100 ms was 711.1 K and 198.4 K respectively. The temperature variation with the change of the hot-spot size and time is also obtained. The maximum temperature was continuously increased in all cases until the hot-spot stops at 100 ms and it was going down after then. Such as, the details of temperature distribution on the SFCL element obtained from this numerical study and it should be very valuable information on the decision of the cooling capacity of cryogenic system

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Applied Superconductivity, IEEE Transactions on  (Volume:16 ,  Issue: 2 )