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Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models

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3 Author(s)
Yeo, A. ; Assembly & Interconnect Technol. Dept., Infineon Technol. Asia Pacific Pte Ltd. ; Lee, C. ; Pang, J.H.L.

Both elastic-plastic-creep and viscoplastic constitutive models may be used for inelastic deformation analysis of solder joints. In this paper, a phenomenological approach using elastic-plastic-creep analysis and an Anand viscoplastic model is reported for solder joint reliability. Flip chip soldered assemblies with 63Sn-37Pb solder joints were subjected to a thermal cyclic loading condition of -40 to +125degC to assess the solder joint fatigue performance. In the finite-element modeling, the viscoplastic strain energy density per cycle obtained from the viscoplastic analysis is compared with the inelastic (plastic and creep) strain energy density per cycle calculated from the elastic-plastic-creep analysis. The inelastic (plastic+creep and viscoplastic) strain energy density extracted from the finite-element analysis results, at the critical solder joint location, were used as a failure parameter for solder fatigue models employed. It was found that the predicted solder joint fatigue life has a better correlation to the first failure or first-time-to-failure result

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:29 ,  Issue: 2 )

Date of Publication:

June 2006

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