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Simultaneously optimizing crosstalk and power for instruction bus coupling capacitance using wire pairing

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3 Author(s)
Naroska, E. ; Fraunhofer IMS, Dusiburg, Germany ; Shanq-Jang Ruan ; Schwiegelshohn, U.

The use of deep-submicrometer (DSM) technology increases the capacitive coupling between adjacent wires leading to severe crosstalk noise, which causes power dissipation and may also lead to malfunction of a chip. In this paper, we present a technique that reduces crosstalk noise on instruction buses. While previous research focuses primarily on address buses, little work can be applied efficiently to instruction buses. This is due to the complex transition behavior of instruction streams. Based on instruction sequence profiling, we exploit an architecture that encodes pairs of bus wires and permute them in order to optimize power and noise. A close to optimal architecture configuration is obtained using a genetic algorithm. Unlike previous bus encoding approaches, crosstalk reduction can be balanced with delay and area overhead. Moreover, if delay (or area) is most critical, our architecture can be tailored to add nearly no overhead to the design. For our experiments, we used instruction bus traces obtained from 12 SPEC2000 benchmark programs. The results show that our approach can reduce crosstalk up to 50.79% and power consumption up to 55% on instruction buses.

Published in:

Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:14 ,  Issue: 4 )