By Topic

Simultaneously optimizing crosstalk and power for instruction bus coupling capacitance using wire pairing

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
E. Naroska ; Fraunhofer IMS, Dusiburg, Germany ; S. -J. Ruan ; U. Schwiegelshohn

The use of deep-submicrometer (DSM) technology increases the capacitive coupling between adjacent wires leading to severe crosstalk noise, which causes power dissipation and may also lead to malfunction of a chip. In this paper, we present a technique that reduces crosstalk noise on instruction buses. While previous research focuses primarily on address buses, little work can be applied efficiently to instruction buses. This is due to the complex transition behavior of instruction streams. Based on instruction sequence profiling, we exploit an architecture that encodes pairs of bus wires and permute them in order to optimize power and noise. A close to optimal architecture configuration is obtained using a genetic algorithm. Unlike previous bus encoding approaches, crosstalk reduction can be balanced with delay and area overhead. Moreover, if delay (or area) is most critical, our architecture can be tailored to add nearly no overhead to the design. For our experiments, we used instruction bus traces obtained from 12 SPEC2000 benchmark programs. The results show that our approach can reduce crosstalk up to 50.79% and power consumption up to 55% on instruction buses.

Published in:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems  (Volume:14 ,  Issue: 4 )