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A novel low-cost QFN (quad flat non-leaded) package is introduced for GaAs MMIC packaging. The air-cavity QFN package is designed and implemented with an HTCC process using alumina substrate. To operate the package up to 40 GHz, several key methods are proposed in this paper. A low noise and a buffer amplifier are packaged for practical application examples and compared with bare die measurements to verify the QFN package performance. A maximum of 4.5 dB insertion loss degradation occurred at 40 GHz. To authors' knowledge, this is the highest operating frequency for QFN type packages with low loss ever reported.
Date of Conference: 3-4 Oct. 2005