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Realization of an Integrated Planar LC Low-Pass Filter with Modified Surface Micromachining Technology

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5 Author(s)
J. Fang ; Institute of Microelectronics, Tsinghua University, Beijing, China. Email: ; Z. W. Liu ; Z. M. Chen ; L. T. Liu
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An Integrated Planar LC LPF(Low-Pass Filter) is designed and fabricated with Modified Surface Micromachining. The LPF is accomplished on low-resistance silicon substrate. To increase the performance of the filter, the substrate underneath the devices is modified with OPS (oxided porous silicon) technology. Measurement results give -3dB bandwidth of 2.925GHz and midband insertion loss of 0.874dB at 500MHz.

Published in:

2005 IEEE Conference on Electron Devices and Solid-State Circuits

Date of Conference:

19-21 Dec. 2005