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Electronic system, platform, and package codesign

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1 Author(s)
Madisetti, V.K. ; Electr. & Comput. Eng., Georgia Inst. of Technol.

Integrating multicore heterogeneous systems into a system-in-package has challenged many design and test engineers. To overcome these obstacles, we need a common EDA tool for digital, analog, RF, and thermal designs. This article proposes a platform-centric design methodology for modern electronic systems that could incorporate system-on-chip, system-in-package, and system-on-package technologies

Published in:

Design & Test of Computers, IEEE  (Volume:23 ,  Issue: 3 )