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Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array

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6 Author(s)
Dong Gun Kam ; Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul ; Joungho Kim ; Jiheon Yu ; Ho Choi
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System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities

Published in:

Design & Test of Computers, IEEE  (Volume:23 ,  Issue: 3 )