Cart (Loading....) | Create Account
Close category search window
 

Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Weiliang Yuan ; Packaging Anal. & Design Center, United Test & Assembly Center Ltd. ; Kuah Hsian Pang ; Wang Chuen Khiang ; Desmond Chong Yok Rue
more authors

In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design

Published in:

Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on

Date of Conference:

Feb. 27 2006-March 3 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.