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Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous body

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4 Author(s)
Asakawa, K. ; Corporate Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan ; Matake, S. ; Hotta, Y. ; Hiraoka, T.

A new type of a flexible printed circuit board with landless vias is developed using a novel method called interconnection via nanoporous structure (INPS). This method can make wires and vias of the printed circuit board simultaneously by a single photo-exposure process. A new photo-induced selective plating method was used to impregnate a nanoporous substrate with copper, and a new photomask was designed, which constitutes of a completely vacant large hole for via and aggregation patterns of very fine holes for wire. Because of the simple process, the INPS board is characterized by landless vias and very fine circuit. Owing to the structure, it is also characterized by flexibility and detachable wires.

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Advanced Packaging, IEEE Transactions on  (Volume:29 ,  Issue: 2 )