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Novel approach of twin-side thermal interfacing of integrated power modules for reduced thermal impedance

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2 Author(s)
Jie Chang ; Electr. & Comput. Eng. Dept., Florida State Univ., Tallahassee, FL ; Changming Liao

A novel approach of twin-side thermal interfaces of integrated power modules (IPM) is presented. This approach applies and improves commercially off-the-shelf products of IPM without significantly changing the original packaging design and manufacture's fabrication process. This approach can reduce the equivalent thermal impedance of the power module by about 20 %. It, in turn, reduces the p-n junction temperature rise of the power devices inside by 20 % at an equivalent load, thus being able to increase ambient operating temperatures, which is desirable for automotive applications. In addition, the weight and volume associated with conventional cooling mechanism can be reduced

Published in:

Power Electronics, IEEE Transactions on  (Volume:21 ,  Issue: 3 )

Date of Publication:

May 2006

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