By Topic

Interconnection and Packaging for 2D Capacitive Micromachined Ultrasonic Transducer Arrays Based on Through-Wafer Trench Isolation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Xuefeng Zhuang ; Edward L. Ginzton Laboratory, Stanford University, Stanford, CA, USA ; A. S. Ergun ; O. Oralkan ; I. O. Wygant
more authors

A new process for connecting elements of a 2D capacitive micromachined ultrasonic transducer (CMUT) array to flip-chip bond pads on the back side of the transducer array is presented. Array elements are isolated from one another by trenches etched into the highly conductive silicon substrate using deep reactive ion etching (DRIE). Gold is deposited on the back side of the array to create the flip-chip bond pads. The array is then flip-chip bonded to an integrated circuit that comprises the front-end circuitry for the transducer and provides mechanical support for the isolated array elements. Because the interconnects are fabricated after the CMUT membranes, this technique is suitable for CMUT arrays regardless of the fabrication techniques used to form the membranes.

Published in:

19th IEEE International Conference on Micro Electro Mechanical Systems

Date of Conference:

2006