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At current operating frequencies, inductive-coupling effects can be significant and should be included for accurate crosstalk-noise analysis. In this paper, an analytical framework to model crosstalk noise in coupled RLC interconnects is presented. The proposed model is based on transmission-line theory and captures high-frequency effects in on-chip interconnects. The new model is generic in nature and can be applied to asymmetric driver-and-line configurations for aggressor and victim wires. The model is compared against SPICE simulations and is shown to capture both the waveform shape and peak noise accurately. Over a large set of random test cases, the average error in noise-peak estimation is approximately 6.5%. A key feature of the new model is that its derivation and form enables physical insight into the total coupling-noise-waveform shape and its dependence on relevant physical-design parameters. Due to its simplicity and physical nature, the proposed model can be applied to investigate the impact of various physical-design optimizations (e.g., wire sizing and spacing, shield insertion) on total RLC coupled noise. The effectiveness of various existing noise-reduction techniques in the presence of mutual-inductance coupling is studied here. The obtained results indicate that common (capacitive) noise-avoidance techniques can behave quite differently when both capacitive and inductive coupling are considered together.