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This paper focuses on the electrical insulation properties of a newly prepared composite material by nano- and micro-filler mixture. Nano- and micro-filler mixture composites were made by dispersing nano-scale layered silicate fillers and micro-scale silica fillers in epoxy resin. To investigate the effects of nano- and micro-filler mixture, the thermal expansion coefficient and insulation breakdown properties by a needle-plate electrode method were measured for the filler mixture composite and the conventional filled epoxy. The filler mixture composite had almost the same thermal expansion coefficient as the conventional filled epoxy. In a continuous voltage rising test, the filler mixture composite had 7% higher insulation breakdown strength than the conventional filled epoxy. Moreover, under constant AC voltage (10 kV at 1 kHz), the filler mixture composite had an insulation breakdown time of more than 20,000 minutes whereas the conventional filled epoxy had a breakdown time of 830 minutes. Electron microscope observation showed that the area surrounded by dispersed micro-scale silica fillers were also filled with the nano-scale layered silicate fillers. Furthermore, the estimate of spacing between the fillers and the filler/epoxy interface area showed a more densely-packed structure of the filler mixture composite than the conventional filled epoxy. The morphological feature of the filler mixture composite seems to improve its insulation breakdown strength and time.