By Topic

Drastic reduction of chemical consumption in wet cleaning process for semiconductor manufacturing by using functional water

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
H. Kurobe ; Kurita Water Industries Ltd., Shinjuku-ku, Tokyo 160-8383, Japan, E-mail address: hiroshi.kurobe@kurita.co.jp ; H. Morita

In cleaning processes of semiconductor manufacturing, a method called `RCA cleaning' is used for a long time. We suggest `functional water cleaning' as the first substituted method of RCA cleaning. Functional water for wet cleaning is water that specific gases are dissolved in, mainly hydrogenated water (H2-water) and ozonated water (O3-water). In this paper, we introduce cleaning effect, impact for cost reduction and ESH (Environment, Safety, Health) protection by using functional water.

Published in:

2005 4th International Symposium on Environmentally Conscious Design and Inverse Manufacturing

Date of Conference:

12-14 Dec. 2005